C103 | High Conductivity Copper
Available formats: Plates, Plates and Plates.
C103 | Cu-HCP is used in applications with a demand for high electrical and thermal conductivity. Also in the use of parts to weld or weld. It is also used for plating. Application examples: devices for electricity and electronics, die casting of die bars for brazing.
Good persistence in the natural atmosphere (also in marine air) and in the industrial atmosphere (dark res., Green spots on the surface), tap and drinking water, aqueous and alkaline solutions (without oxidant), pure steam, non-acidic oxidants (as far as there is no oxygen). in solution) and neutral solutions of salts.
The C103 | Cu-HCP can be tempered in an atmosphere containing hydrogen without risk of embrittlement. Intensity against stress corrosion cracking. Without persistence in solutions of cyanides, halides and ammonia, oxidizing acids, liquid ammonia, halogen gas, hydrogen sulfide and water.
The C103 | Cu-HCP is a low purity, high level residual phosphorus deoxidized copper. It has a very high electrical and thermal conductivity, good soldering and soldering properties, as well as resistance to hydrogen. It has excellent hot and cold forming properties, and good corrosion resistance in water and especially in the atmosphere (including the industrial atmosphere).
Applications
Electric
High frequency cable, submarine cable strips, waveguide tube, standard material for longitudinally welded cables, switches, applications requiring high conductivity, tube bus, electrical conductors, clad products, bus bars, terminals, thermostatic control tubes.
Industrial
Applications requiring good welding, applications requiring good weldability, pressure vessels, billet mold tube, extrusion cans for powder metallurgy.
The electrical conductivity is strongly influenced by the chemical composition. A high level of cold deformation and a small grain size decrease electrical conductivity moderately. Minimum conductivity level can be specified
Resistant to: Atmospheric corrosion: formation of a greenish protective patina due to the formation of basic copper salts (such as sulfates, chlorides in the marine environment, nitrates and carbonates)
Water (industrial and drinkable). Aqueous and alkaline solutions (non-oxidizing), pure water vapor (steam), non-oxidizing acids (without oxygen in solution), neutral saline solutions.
The material can be heat treated in a reducing atmosphere.
Insensitive to stress corrosion cracking.
Not resistant to: oxidizing acids, solutions containing cyanides, ammonia or halogens, hydrated ammonia and halogenated gases, hydrogen sulfide, sea water.
Chemical composition
>
%
|
Cu
|
Al
|
Bi
|
Co
|
OR
|
Fe
|
P
|
Pb
|
Si
|
Zr
|
Others
|
Min. |
99,95 |
- |
- |
- |
- |
- |
0,002 |
- |
- |
- |
- |
Max. |
- |
- |
0,0005 |
- |
- |
- |
0,007 |
0,005 |
- |
- |
0,03 |
Chemical composition according to EN 12163
Chemical composition
Element
|
Min.%
|
Max. %
|
Cu Al Bi Co OR Fe P Pb Si Zr Others / Alloys |
99,95 - - - - - 0,002 - - - - |
- - 0,0005 - - - 0,007 0,005 - - 0,03 |
Chemical composition according to EN 12163
International Equivalences
BRONCESVAL
|
ISO
|
W Nr / DIN
|
ASTM (UNS)
|
UNE
|
BS
|
DIN / ISO
|
DIN OLD
|
C103 |
Cu-HCP |
CW021A |
C10300 |
CU HCP |
C103 |
SE-CU |
2.0070 |
Mechanical properties
Tensile strength
(MPa) |
Elastic limit
0.2 % (MPa) |
Elongation
minimum W50mm |
Electric conductivity
% IACS (b) max.
|
Hardness
Hv |
Specific weight
Approx. g / cm3 |
200 to? 360 |
? 100 a? 320 |
(? 2.5 mm) 42 to 2 |
96.6 to 100 |
40 a? 110 |
8,9 |
*For information only. | from R200 to R360 | (b) IACS: International Annealed Copper Standard | Typical values in annealing temper at 20 ° C
International Equivalences
BRONCESVAL | C103 |
---|---|
ISO | Cu-HCP |
W Nr / DIN | CW021A |
ASTM (UNS) | C103000 |
UNE | CU ETP |
BS | C103 |
DIN / ISO | SE-CU |
DIN OLD | 2.0070 |
Mechanical properties
Tensile strength (MPa) | 200 to? 360 |
---|---|
Elastic limit 0.2 % (MPa) | ? 100 a? 320 |
Minimum elongation W50mm
|
(? 2.5 mm) 42 to 2 |
Electrical conductivity % IACS (b) max. | 94.8 to 98.3 |
Brinell hardness (HV) | 40 a? 110 |
Specific Weight Approx. g / cm3 | 8,93 |
*For information only. | from R200 to R360 | (b) IACS: International Annealed Copper Standard | Typical values in annealing temper at 20 ° C
General Physical Properties
Thermal expansion coefficient from -191ºC to 16 ° C | 16.9 10-6 / K |
---|---|
Thermal expansion coefficient from 0ºC to 300 ° C | 17.7 10-6 / K |
Specific heat capacity | 0.385 J / (g · K) |
Thermal conductivity | 385 W / (m · K) |
Electrical conductivity (1 MS / m = 1 m / (? Mm²) | ? 57 MS / m |
Electrical conductivity (IACS) | 98 % |
Thermal coefficient of electrical resistance (0 .. 200 ° C) | 3.7 10-3 / K |
Modulus of elasticity (1 GPa = 1 kN / mm²) cold annealed | 132 GPa |
Typical values in annealing temper at 20 ° C
Manufacturing Properties
Cold forming properties | Excellent |
---|---|
Hot forming properties at 750º C to 950 ° C | Good |
Machinability (rating 20) | Less suitable |
Electroplating properties | Excellent |
Hot tin plating properties | Excellent |
Smooth welding | Excellent |
Resistance welding | Less suitable |
Arc welding with gas protection | Excellent |
Laser welding | Fair |
Soft annealed | 250ºC to 650 ° C |
Annealed to relieve stress | 150ºC to 200 ° C |
During heating in a reducing atmosphere, hydrogen can penetrate into copper and react with Cu oxide to water vapor. Its pressure can cause fragility.
Formats
- C103 Copper Plates
- C103 Copper Plates
- Copper Plates C103